Bedrock V3000 Basic

SolidRun’s Bedrock industrial PCs are powered by an AMD RyzenTM Embedded V3C48 processor, a cutting-edge 6nm 8C/16T CPU that delivers exceptional performance and energy efficiency. Bedrock PCs harness the full power of the processor, including 20 lanes of PCIe Gen4, to keep up with the CPU’s memory, networking, and I/O capabilities.

The result is unparalleled performance for a compact and fanless industrial PC.

Despite its fanless design, the Bedrock V3000 Basic industrial PC boasts an impressive range of features including 64 GB DDR5 ECC, NVME Gen4 2280, 2x 10 GbE SFP+ copper/fiber + 4x 2.5 GbE ports, WiFi 6E, 5G modem with dual SIM, and 4 USB ports.

Moreover, the memory and networking capabilities of the Bedrock V3000 Basic industrial PCs offer high capacity and performance.

Chips that generate significant heat must be effectively cooled. The Bedrock industrial PCs were designed from the ground up for fanless cooling. The CPU is thermally coupled to the case using liquid metal thermal interface material (TIM) to reduce thermal resistance.

Stacked heatpipes evenly distribute the heat around the full aluminum case in a 360-degree pattern. To optimize convective heat transfer, each side of the case features two heat exchange layers: aluminum air channels to initiate airflow through the chimney effect, and a conventional heat sink layer. As a result, the Bedrock can dissipate more than three times the power of similarly sized fanless PCs.

Cooling secondary heat sources is an important prerequisite for reliable 24/7 operation under extreme memory or network usage profiles.

All power-consuming devices in the Bedrock V3000 Basic industrial PCs are thermally coupled to the case, including the 3 NVMe drives, two SODIMMs, power FETs, NICs, SFP+ cages, WiFi adapter, and 5G modem.

SolidRun’s Bedrock industrial PCs are designed with decades of experience in developing industrial PCs and embedded systems, ensuring high reliability.

DC power is supplied through a screw-locking terminal block with a wide voltage range of 12V-60V with two regulation stages. RAM supports ECC. NVMe with Power-Loss-Protection (PLP) can be ordered. Bedrock features redundant SPI flash that protects BIOS from damage, as well as WDT and TPM. The case is extremely rugged and made of aluminum. Additionally, the case is fanless and dustproof with an IP40 rating.

SolidRun’s Bedrock industrial PCs are designed to meet diverse requirements in the IoT space, achieved through hardware division into the following boards:

• System on Module (SoM) with CPU, DDR5 and NVMe slots, and all native interfaces on 380 pins with high-density connectors.
• Network and I/O Board (NIO) with NICs and ports.
• Storage and Extension Cards Board (SX) with slots for WiFi, 5G modem, and additional NVMe devices.
• Power Module (PM) with DC-DC converter and DC input connector.

This modular design enables flexible customization of Bedrock industrial PCs to specific requirements. SolidRun develops multiple NIO, SX, and PM boards that can be combined as standard solutions. Additionally, the company offers ODM service for the development of customized boards. Customers and third-party developers interested in developing custom NIO, SX, or PM boards are welcome to contact our sales team.

The compact footprint, rugged structure, effective fanless cooling, and tolerance for DC input of Bedrock industrial PCs simplify integration into an existing IT infrastructure. All interfaces are located on the front, with the DC input and antennas on the top. The bottom and back are reserved for mounting, making Bedrock industrial PCs usable on both walls and desks.

SolidRun offers several types of mounting brackets, including a lever-based DIN rail mount with locking, a wall mount, and a small and rugged stand.

Since Bedrock industrial PCs are fanless, they require no maintenance and are designed to not require opening while in the field. SIM cards are accessed from the plate through pinhole slots. The remote power switch connector is conveniently located on the top of the device.

All brackets and mounting fixtures are installed from the outside. If necessary, opening Bedrock industrial PCs requires only the removal of a single screw.

When installing an industrial PC in a tight space, convection cooling becomes ineffective and should be replaced with a conductive cooling system. Additionally, it is desirable to design industrial PCs as compact and thin as possible.

Bedrock Tile is designed for these use cases. The ribbed case walls are replaced by flat walls with blind threads for fastening Bedrock Tile to a heat sink. A key feature of Bedrock Tile is maintaining the internal 360°C heat distribution, allowing it to be cooled from both sides. With a thickness of only 29mm and a volume of 0.6 liters, Bedrock Tile can be easily integrated into tight spaces. All interfaces are located on one side, further simplifying integration.

Certain integration scenarios require custom enclosures, such as when additional devices need to be installed in the same enclosure as the computer. To support these use cases, SolidRun has developed the deck-of-cards concept. SoM, NIO, SX, and PM are rigidly held together with fasteners, independent of the Bedrock enclosure.

The deck provides a primary cooling stage for most devices, notably including a copper heat plate on the CPU. The deck is attached to the custom enclosure with only 3 screws. The fastening ensures thermal coupling with the CPU, RAM, NVMe, and FETs. The DC input connector is on wires and can be routed within the enclosure.

Bedrock SoM is a practical and flexible building block for board designers that offers many benefits. For many developers, using a SoM is the only way to develop a computer based on AMD Ryzen™ Embedded V3000.

The SoM is much more self-contained than traditional SoMs, providing not only the essential CPU and RAM but also NVMe, a direct DC input with a tolerance of 12 to 19 V, and an RTC battery. The SoM is housed in a robust metal enclosure that protects the SoM, provides a mounting mechanism for expansion cards, and serves as a heat spreader for secondary heat sources. Additionally, a copper heat plate is pre-mounted on the CPU.