Bedrock R7000 Basic

The SolidRun Bedrock R7000 Basic is powered by the AMD Ryzen™ 7 7840HS / 7840U processor with 8 Zen 4 cores and 16 threads running at speeds up to 5.1GHz. The APU includes an AMD Radeon™ 780M GPU with 12 CUs running at 2700MHz.

Manufactured using TSMC’s advanced 4nm FinFET process, it is the most power-efficient high-performance x86 CPU on the market for computing and graphics applications.

The input/output, storage and networking devices on the SolidRun Bedrock R7000 Basic are as powerful as they are large. The powerful Radeon 780M GPU drives 4 display outputs HDMI 2.1 / DP 2.1, each capable of 8K or supporting 4x4K. The device is equipped with 64 GB DDR5 with ECC, 3x NVME Gen4 2280, 2x 2.5 GbE ports, WiFi 6E, a 5G modem with dual SIM and 4 USB ports. All of this is packed into a fanless chassis that is less than 1 litre in volume.

Hot chips demand innovative cooling methods. Bedrock has been designed from the ground up for effective fanless cooling. The CPU is thermally bonded to the chassis with liquid metal TIM (Thermal Interface Material) to reduce thermal resistance.

Stacked heat pipes distribute heat evenly 360º around the all-aluminium chassis. To optimise convective heat transfer, each side of the chassis has two layers of heat exchangers – aluminium chimney-effect air ducts and a layer of conventional cooling fins. As a result, Bedrock can dissipate more than three times the heat of fanless computers of similar size.

With the Bedrock R7000, you can accurately determine the power consumption of your system, rather than guessing. You can accurately set the CPU power limit within an exceptionally wide power range of 8W to 54W.

This is particularly useful in scenarios where the available power needs to be shared between the IPC and additional devices, and where integration constraints prevent ideal heat dissipation.

The Bedrock system has been designed with reliability in mind, based on decades of experience in IPC and embedded system design.

The DC power supply is provided via a screw lock terminal block and offers a wide voltage range of 12V – 60V with two regulation levels. The RAM supports ECC. An NVMe with uninterruptible power supply (UPS) can be ordered as an option. Bedrock features redundant SPI flash memory to prevent BIOS corruption lockouts, as well as WDT and TPM. The chassis is extremely rugged – all aluminium, no fan, no vents, IP40 dust rated.

The Bedrock system is designed to meet the diverse requirements of the IoT sector. This is achieved by dividing the hardware into the following subassemblies

• System on Module (SoM) with CPU, DDR5 and NVMe slots and all native interfaces on 380-pin high density connectors.
• Network and I/O board (NIO) with network interface cards (NICs) and ports.
• Storage and Expansion Board (SX) with slots for WiFi, 5G modem and additional NVMe devices.
• Power Module (PM) with DC-DC converter and DC input connector.

This modular design allows Bedrock to be flexibly customised to meet specific requirements. SolidRun is developing several NIO, SX and PM boards that can be combined as an off-the-shelf solution. The company also offers custom board development as an ODM service. Customers and third parties interested in developing custom NIO, SX or PM boards can contact SolidRun for assistance.

The Bedrock chassis is designed with customisation in mind. Modifications to I/O, power supply, antenna openings, etc. can be made cost-effectively even in small quantities.

Bedrock’s compact design, rugged construction, efficient fanless cooling and DC input tolerance make it easy to integrate. All of Bedrock’s I/O ports are located on the front panel, while the DC input and antennas are located on the top. Both the bottom and back are designed for mounting. This ensures full usability when Bedrock is mounted on a wall or desk.

SolidRun offers several types of mounting brackets, including a lever-operated DIN rail bracket with lock, a wall bracket, a small stand and a sturdy stand.

Because Bedrock industrial PCs are fanless, they require no maintenance. They are designed so that they do not need to be opened in the field. SIM cards are accessible from the front panel through pinhole slots. The remote power switch connector is conveniently located on the top of the unit.

All brackets and mounting hardware are external. If it becomes necessary to open the Bedrock Industrial PC, it can be done by loosening a single screw.

When an industrial PC is installed in a confined space, recirculating air cooling becomes ineffective and should ideally be replaced by conduction cooling. It is also desirable to make industrial PCs as compact and slim as possible.

Bedrock Tile is designed for these applications. The ribbed case walls are replaced by flat walls with blind threads for attaching the Bedrock Tile to a heat sink. A key feature of Bedrock Tile is its ability to maintain 360°C internal heat distribution, allowing it to be cooled from both sides. With a thickness of only 29mm and a volume of 0.6 litres, Bedrock Tile is easy to integrate into tight spaces. With all connections on one side, integration is further simplified.

Some integration scenarios require customised enclosures, especially when additional devices need to be installed with the computer in the same enclosure. To support these use cases, SolidRun has developed the Deck of Cards concept. The SoM, NIO, SX and PM are rigidly held together with fasteners, independent of the Bedrock chassis.

The deck provides a primary level of cooling for most devices, notably a copper heat plate on the CPU. The deck is secured to the custom chassis with just 3 screws. This ensures thermal coupling with the CPU, RAM, NVMe and FETs. The DC input connector is on wires and can be placed inside the case.

The Bedrock SoM is a convenient and flexible building block for board designers and offers many benefits. For many developers, using a SoM is the only way to build a computer based on AMD Ryzen™ Embedded V3000.

The SoM is much more self-contained than traditional SoMs: It includes not only the essential CPU and RAM, but also NVMe, a direct 12 to 19V DC input, and an RTC battery. The SoM is housed in a robust metal case that protects the SoM, provides a mounting mechanism for expansion cards and acts as a heat sink for secondary heat sources. A copper heat plate is also pre-installed on the CPU.